Enhanced damping and thermal conductivity of hBN/silicone rubber composites via strong interfacial action
نویسندگان
چکیده
Abstract High integration and miniaturization of electronic systems require thermal conductivity mechanical damping materials. In this study, hexagonal boron nitride ( h BN) particles were modified by vinyltrimethoxysilane (V171) hexadecyltrimethoxysilane (N3116) for comparing, described as V171- BN N3116- BN, respectively. The pristine surface filled in vinylmethylpolysiloxane (VMQ), then vulcanized to fabricate BN/silicone rubber composites. properties composites significantly higher than that composites, while contrast. strong interfacial action came from the chemical bond vinyl groups on taking part vulcanization VMQ. This led deformation internal friction between layers increased dissipate more energy. As a result, with excellent well good obtained.
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ژورنال
عنوان ژورنال: Materials research express
سال: 2022
ISSN: ['2053-1591']
DOI: https://doi.org/10.1088/2053-1591/ac648d